Special characteristic of future flip chip underfill materials and the process

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1661-1665

  Usui, Hal ^a   Mizutani, Masaki ^b   Noro, Hiroshi ^b   Kuwamura, Makoto ^b   Kuroyanagi, Akihisa ^b   Ito, Hisataka ^b   Harada, Tadaaki ^b   Ito, Satoshi ^b  

^a Nitto Denko America   (United States)

^b NITTO DENKO CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; SOLDERING; SUBSTRATES; TRANSFER MOLDING;

FUTURE FLIP CHIP UNDERFILL MATERIAL; PRESET UNDERFILL PROCESS;

ELECTRONICS PACKAGING;

EID: 0034483662     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)