New stress voiding observations in Cu interconnects

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 36-38

  Gregoire, M ^a   Kordic, S ^b   Ignat, M ^c   Federspiel, X ^b   Vannier, P ^a   Courtas, S ^b  

^a STMICROELECTRONICS   (France)

^b NXP SEMICONDUCTORS   (Netherlands)

^c GRENOBLE INSTITUTE OF TECHNOLOGY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION; MICROSTRUCTURE; RELIABILITY; SILICON WAFERS; TENSILE STRENGTH;

METAL PATTERN DENSITY; STRESS VOIDING (SV); ZERO-STRESS TEMPERATURE;

LARGE SCALE SYSTEMS;

EID: 28244500493     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. A. Baldacci et al., "Stresses in copper blanket films and damascene lines: measurements and finite element analysis," IEEE European Solid-State Dev. Res. Conf., pp 105-108, 2004.
2. E.T. Ogawa et al., "Stress-induced voiding under vias connected to wide Cu metals leads," IEEE Int. Rel. Phys. Symp., Pros. pp312-321, 2002.
3. Y.K. Lim et al., "Stress-induced voiding in multi-level copper/ low-k interconnects," IEEE Int. Rel. Phys. Symp., Proc. pp240-245, 2004.
4. C. Roussel et al., "Voiding in Cu dual damascene metallization due to Cu densification during thermal stress," Adv. Metallization Conf., San Diego, CA, 2002.
5. X. Federspiel et al., "Stress induced degradation of 90nm node interconnects," IEEE Int. Rel. Phys. Symp., Proc. pp623-624, 2004.
6. N. Okada et al., "Thermal stress of 140 nm-width Cu damascene interconnects," IEEE Int. Interconnect Tech. Conf., Proc. pp 136-138, 2002.
7. S. Kordic et al., "Correlation between stress voiding of Al(Si)(Cu) metallizations and crystal orientation of aluminum grains,"J. of Appl. Phys., vol.74, 1993, pp5391-5394.
8. rd Int. Conf. on Stress-Induced Phenomena in Metallizations, Stanford, CA, 1995.
9. S. Kordic et al., "Size and volume distributions of thermally induced stress voids in AlCu metallization," Appl. Phys. Lett., vol.68, no.8, 1996, pp1060-1063.