Stresses in copper blanket films and damascene lines: Measurements and finite element analysis

ESSCIRC 2004 - Proceedings of the 34th European Solid-State Device Research Conference

Volumn , Issue , 2004, Pages 105-108

  Baldacci, A ^a   Rivero, C ^a,c   Gergaud, P ^a   Gregoire M ^c   Sicardy, O ^b   Bostrom, O ^c   Boivin, P ^c   Micha, J S ^b   Thomas, O ^a  

^a CNRS   (France)

^b CEA GRENOBLE   (France)

^c STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER BLANKET FILMS; DAMASCENE COPPER LINES; ELECTROCHEMICAL DEVICES; THERMAL EXPANSION COEFFICIENTS (TEC); THERMO-ELASTIC BEHAVIOR;

CHEMICAL MECHANICAL POLISHING; FINITE ELEMENT METHOD; LATTICE CONSTANTS; METALLIC FILMS; MICROELECTRONICS; PHYSICAL VAPOR DEPOSITION; SHEAR STRESS; STRESS ANALYSIS; THERMOELASTICITY; THIN FILMS; X RAY DIFFRACTION ANALYSIS; X RAYS;

COPPER;

EID: 17644423165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. I. Noyan , J. Cohen, Residual stress (Springer Verlag, Stuttgart, 1987), B.M. Clemens and J.A. Bain, MRS Bulletin 46 (1992) 17-7
3. I. Noyan , J. Cohen, Residual stress (Springer Verlag, Stuttgart, 1987), B.M. Clemens and J.A. Bain, MRS Bulletin 46 (1992) 17-7
4. Y.S. Touloukian, Thermophysical properties of matter, 12 (1975) 77-91
5. M. J. Kobrinsky, C. V. Thompson, M. E. Gross, Diffusional creep in damascene Cu lines, J. of Applied Physics, (2001), Volume 89, Number 1, p91-98.
6. J. Zhao, W.-. Qi, P. S. Ho, Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper, submicron interconnect structures, Microelectronics Reliability 42 (2002) 27-34.
7. Thermophysical properties of matter, thermal expansion, metallic elements and alloys, vol. 12, eds Touloukian et al., IFI Plenum, 1975.