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Volumn 68, Issue 8, 1996, Pages 1060-1062
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Size and volume distributions of thermally induced stress voids in AlCu metallization
a b a |
Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0342513674
PISSN: 00036951
EISSN: None
Source Type: Journal
DOI: 10.1063/1.115712 Document Type: Article |
Times cited : (2)
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References (4)
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