Microstructure effect on EM-induced copper interconnect degradation: Experiment and simulation

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 629-638

  Zschech, E ^a   Sukharev, V ^b  

^a IBM MICROELECTRONICS   (United States)

^b AGERE SYSTEMS   (United States)

Author keywords

Copper interconnect; Electromigration; Microstructure; Reliability

Indexed keywords

COMPUTER SIMULATION; COPPER; DEGRADATION; ELECTROMIGRATION; INTERCONNECTION NETWORKS; RELIABILITY;

COPPER INTERCONNECTS; IN SITU MICROSCOPY;

MICROSTRUCTURE;

EID: 28044472979     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.07.067     Document Type: Conference Paper

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