Study of structural changes and properties for Sn-Zn9 lead-free solder alloy with addition of different alloying elements

Radiation Effects and Defects in Solids

Volumn 160, Issue 1-2, 2005, Pages 45-52

  Kamal, Mustafa ^a   Meikhail, M S ^a   El Bediwi, Abu Bakr ^a   Gouda, El Said ^a  

^a Mansoura University   (Egypt)

Author keywords

Double bridge; Lead free; Solder; Wettability; X ray diffraction

Indexed keywords

ALLOYING ELEMENTS; ELECTRIC CONDUCTIVITY; INTERMETALLICS; MELTING; SOLDERING ALLOYS; SOLIDIFICATION; THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS;

DOUBLE BRIDGE; LEAD-FREE; SOLDERS; WETTABILITY;

TIN ALLOYS;

EID: 27844548677     PISSN: 10420150     EISSN: 10294953     Source Type: Journal    
DOI: 10.1080/10420150500085810     Document Type: Article

References (19)

1. M. McCormack and S. Jin, J. Electron. Mater. 23 (special issue) (1994).
2. K. Uenishi, T. Saeki, Y. Kohara, K.F. Kobayashi, I. Shoji, M. Nishiura and M. Yamamoto, Mater. Trans. 42 756 (special issue) (2001).
3. K. Uenishi, Y. Kohara, S. Sakatani, K.F. Kobayashi and M. Yamamoto, Mater. Trans. 43 1833 (special issue) (2002).
4. B.R. Allenby, Proc. Surface Mount Intl. 1 (1992).
5. P.G. Harris and M.A. Whitmore, Circuit World 19(2) 25 (1993).
6. M. Abtew and G. Selvaduray, Mater. Sci. Eng. Rep. 27 95 (2000).
7. J.H. Vincent and G. Humpston, GEC J. Res. 11 76 (1994).
8. M.R. Harrison, J.H. Vincent and H.A.H. Steen, Sold. Surf. Mount Technol. 13 21 (2001).
9. W. Yang and R.W. Messler Jr, J. Electron. Mater. 23 765 (1994).
10. H. Mavoori, J. Chin, S. Vaynman, et al., J. Electron. Mater. 41 1269 (1997).
11. M. McCormack, S. Jin and G.W. Kammlott, Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE, Orlando, FL, USA May 1-3 (1995), pp. 171-176.
12. F. Hua and J. Glazer, Paper presented at the TMS Annual Meeting, p. 65 (1997).
13. S. Vaynman and M.E. Fine, Scr. Mater. 41 1269 (1999).
14. G. Alexandrine, W. Eric and Z. Christain, Microelectron. Reliab. 42(9-11) 1555 (2002).
15. S.K. Das, Reviews in Particulate Materials Vol. 1 (Metal Industries Federation, Princeton, NJ, 1993).
16. Yu.A. Geller and A.G. Bakhshtadt, Sci. Mater (Mir Publishers, 1977).
17. Y.-S. Kim, K.-S. Kim, C.-W. Hwang et al., J. Alloys Comp. 352 237-245 (2003).
18. Introduction to Solid State Physics; Principles and Applications, M.A. OMAR (1978), Ch. 4.
19. K.J.R. Wassink and M.M.F. Verguld, Manufacturing Techniques for Surface Mounted Assemblies, Electro-chemical Publications Ltd., GB-Port Erin, British Isles (1995), p. 17.