Evaluation of lead-free soldering for automotive applications

Microelectronics Reliability

Volumn 42, Issue 9-11, 2002, Pages 1555-1558

  Guédon, Alexandrine ^a   Woirgard, Eric ^a   Zardini, Christian ^a  

^a UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; SOLDERED JOINTS; SOLDERING; TIN;

AUTOMOTIVE APPLICATIONS; LEAD-FREE COMPONENTS; LEAD-FREE SOLDER PASTE; LEAD-FREE SOLDERING; SOLDER ALLOYS; SOLDER JOINTS; SOLDER PASTE; TRANSITION PERIOD;

LEAD-FREE SOLDERS;

EID: 29244459663     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00189-0     Document Type: Conference Paper

References (6)

1. www.europarl.eu.int/
2. T.E.Bloomer, "Microstructural and Mechanical Properties of a Novel Lead-Free Solder", Master of Science Thesis, Iowa State University, 1999.
3. th IEEE Electronic Components and Technology Conference, pp.1172-1183, Orlando, May 1996.
4. Q. Zhu, M. Sheng, L. Luo, "The Effect of Pb Contamination on the Microstructure and Mechanical properties of SnAg/Cu and SnSb/Cu Solder Joints in SMT", Soldering and Surface Mount Technology, vol.12 no3, pp. 19-23, March 2000.
5. G.M. Martin, M. Le Meau, K. Henry, O. Goguet, R. Maillet, "New Lead Free Technology for High Temperature Mechatronics", Proc. Electronic Systems for Vehicles, pp. 729-735, Baden-Baden, Germany, September 27-28 2001
6. T.S. Summers, "Improving Fatigue Life in Near-Eutectic SnPb Solders", PhD Thesis, University of California at Berkeley, 1991