Study on abrasive effect in copper chemical-mechanical polishing

Mocaxue Xuebao/Tribology

Volumn 25, Issue 5, 2005, Pages 431-435

  Li, Xiu Juan ^a   Jin, Zhu Ji ^a   Kang, Ren Ke ^a   Guo, Dong Ming ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Abrasive; Copper CMP; Friction; Material removal mechanism

Indexed keywords

COPPER; FRICTION; POLISHING; SURFACE ROUGHNESS; TESTING;

COPPER CHEMICAL-MECHANICAL POLISHING (CMP); FRICTION COEFFICIENT; MATERIAL REMOVAL MECHANISM; MATERIAL REMOVAL RATE; PARTICLE SIZE; SLURRY FLOW RATE;

ABRASIVES;

EID: 27844520286     PISSN: 10040595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

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