Board level reliability assessment of chip scale packages

Microelectronics Reliability

Volumn 39, Issue 9, 1999, Pages 1351-1356

  Wang, Z P ^a   Tan, Y M ^a   Chua, K M ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; ELECTRIC RESISTANCE; FAILURE ANALYSIS; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; THERMAL CYCLING; THERMOANALYSIS; VIBRATIONS (MECHANICAL); WEIBULL DISTRIBUTION;

CHIP SCALE PACKAGES (CSP);

ELECTRONICS PACKAGING;

EID: 0033322722     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00057-8     Document Type: Article

References (11)

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