A novel CBCM method free from charge injection induced errors: Investigation into the impact of floating dummy-fills on interconnect capacitance

IEEE International Conference on Microelectronic Test Structures

Volumn , Issue , 2005, Pages 235-238

  Chang, Y W ^a,b   Chang, H W ^a   Lu, T C ^a   King, Y ^b   Ting, W ^a   Ku, J ^a   Lu, C Y ^a  

^a MACRONIX INTERNATIONAL CO LTD   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CROSSTALK; MICROPROCESSOR CHIPS;

CHARGE-INJECTION; CIRCUIT DESIGN; INTERCONNECT CAPACITANCE;

MICROELECTRONICS;

EID: 27644532654     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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