Adhesion promotion of the polyimide-copper interface using silane-modified polyvinylimidazoles

Journal of Applied Polymer Science

Volumn 68, Issue 8, 1998, Pages 1343-1351

  Jang, Jyongsik ^a   Jang, Inkook ^a   Kim, Hyuncheol ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL BONDS; CONTACT ANGLE; COPOLYMERIZATION; COPPER; FOURIER TRANSFORM INFRARED SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SILANES; THERMOOXIDATION; VINYL RESINS;

ALLYLTRIMETHOXY SILANE; METHACRYLOXYPROPYLTRIMETHOXYSILANE; POLYVINYLIMIDAZOLES; PYLTRIMETHOXYSILANE; VINYLTRIMETHOXY SILANE;

POLYIMIDES;

EID: 0032069972     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19980523)68:8<1343::AID-APP17>3.0.CO;2-#     Document Type: Article

References (24)