The connection between microstructural damage modeling and continuum damage modeling for eutectic Sn-Pb solder alloys

International Journal of Damage Mechanics

Volumn 14, Issue 4, 2005, Pages 343-363

  Sharma, P ^a   Dasgupta, A ^b   Cuddalorepatta, G ^b  

^a UNIVERSITY OF HOUSTON   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Continuum damage model; Creep; Creep rupture; Cyclic loading; Eutectic Sn Pb solder; Grain boundary sliding diffusion; Microstructural damage model; Plastic collapse; Void growth; Void nucleation

Indexed keywords

CREEP; CRYSTAL GROWTH; CRYSTAL MICROSTRUCTURE; EUTECTICS; GRAIN BOUNDARIES; MATHEMATICAL MODELS; NUCLEATION; TIN ALLOYS;

CONTINUUM DAMAGE MODEL; CREEP RUPTURE; GRAIN BOUNDARY SLIDING DIFFUSION; MICROSTRUCTURAL DAMAGE MODEL; PLASTIC COLLAPSE; VOID GROWTH; VOID NUCLEATION;

SOLDERING ALLOYS;

EID: 27144518183     PISSN: 10567895     EISSN: None     Source Type: Journal    
DOI: 10.1177/1056789505054302     Document Type: Article

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