Three-dimensional simulation of wire sweep during semiconductor-chip encapsulation

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 2, Issue , 2003, Pages 1310-1314

  Han, Sejin ^a   Costa, Franco S ^b   Ray, Shishir ^b  

^a Moldflow Corporation   (United States)

^b Moldflow Pty Ltd   (Australia)

Author keywords

Flow simulation; Microchip encapsulaion; Three dimensional analysis; Wire sweep

Indexed keywords

COMPUTATIONAL GEOMETRY; COMPUTER SIMULATION; ENCAPSULATION; MICROPROCESSOR CHIPS; PLASTIC FLOW;

WIRE SWEEP;

TRANSFER MOLDING;

EID: 0141616563     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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