Time-accurate, 3-D computation of wire sweep during plastic encapsulation of IC components

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 158-167

  Yang, H Q ^a   Bayyuk, S A ^a   Nguyen, L T ^a  

^a CFD RESEARCH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTATIONAL METHODS; COMPUTER SIMULATION; DEFORMATION; ELECTRONICS PACKAGING; ENCAPSULATION; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; PLASTIC COATINGS; STRESSES; TRANSFER MOLDING; VISCOUS FLOW;

MELT FRONT; WIRE SWEEP;

WIRE;

EID: 0030682047     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)