Flow modeling of wire sweep in transfer molding

American Society of Mechanical Engineers, EEP

Volumn 17, Issue , 1996, Pages 55-64

  Chen, Xiao Hong ^a   Lee, K S ^a   Yuen, M M F ^a   Tong, Pin ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; COMPUTER SIMULATION; DEFECTS; ENCAPSULATION; INTEGRATED CIRCUITS; MOLDING; TRANSFER MOLDING; WIRE;

STOKES FLOW ANALYSIS; WIRE SWEEP;

ELECTRONICS PACKAGING;

EID: 0030383171     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)