Transfer of metal MEMS packages using a wafer-level solder sacrificial layer

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2005, Pages 584-587

  Welch III, Warren C ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ELECTROPLATING; SILICON WAFERS; SOLDERING; THERMAL EFFECTS;

CARRIER WAFERS; MEMS PACKAGES; TRANSIENT LIQUID PHASE (TLP); WAFER-LEVEL ENCAPSULATION;

MICROELECTROMECHANICAL DEVICES;

EID: 26844463988     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. W.T. Hsu, J.R. Clark, C.T.-C. Nguyen, "A sub-micron capacitive gap process for multiple-metal-electrode lateral micromechanical resonators", Proc IEEE Micro Electro Mech Syst MEMS, Interlaken, Jan 21-25, 2001, pp. 349-352.
2. K. Najafi., "Micropackaging technologies for integrated microsystems: Applications to MEMS and MOEMS", Proc. SPIE 2003 Micromachining and Microfabrication Process Technology VIII, vol 4983, Jan 27-29, 2003, pp.1-19.
3. B.H. Stark and K. Najafi, "A low-temperature thin-film electroplated metal vacuum package", J. Microelectromech. Syst., vol. 13, pp. 147-157, 2004.
4. R.R. Tummala, E.J. Rymaszewski, Microelectronics packaging handbook, Van Nostrand Reinhold New York, 1989.
5. T.W. Kenny, et. al., "An integrated wafer-scale packaging process for MEMS", in '02 ASME International Mechanical Engineering Congress and Exposition, New Orleans, Nov 17-22, 2002, pp. 51-54.
6. C.T. Pan, "Selective low temperature microcap packaging technique through flip chip and wafer level alignment", J. Micromechanics and Microengineering, vol. 14, pp. 522-529, 2004.
7. Y. J. Chiang, M. Bachman, and G.P. Li, "A Wafer-Level Microcap Array to Enable High-Yield Microsystem Packaging", IEEE Trans. on Advanced Packaging, Vol. 27, No. 3, 2004.
8. J.Y. Chen, "A novel device-level micropackaging using micro assembly transfer", Proc. 2001 ASME International Mechanical Engineering Congress and Exposition, New York, Nov 11-16, 2001, pp. 769-774.
9. G. Humpston and D.M. Jacobson, Principles of Soldering, (ASM International, 2004)
10. P.K. Khanna, G. Dalke, and W. Gust, "Morphology and long term stability of Ni/Ni interconnections based on diffusion soldering", Materials Research and Advanced Techniques, vol. 90, pp. 722-726, 1999.