Low k material optimization

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2001, Pages 203-205

  MacWilliams, Ken ^a   Huang, Judy ^a   Schulberg, Michelle ^a   Van Cleemput, Patrick ^a  

^a NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MICROELECTRONIC PROCESSING; OPTIMIZATION; PERMITTIVITY;

MATERIAL OPTIMIZATION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0035174629     PISSN: 1523553X     EISSN: None     Source Type: Journal    
DOI: 10.1109/ISSM.2001.962949     Document Type: Article

References (4)

1. Interconnect technology challenges for the new millennium (invited)
2. Low k dielectric integration challenges (invited)
3. The characterization of trimethylsilane based PE-CVD a-SiCO:H low-k Films
4. PECVD deposited SiCOH films with reduced dielectric constants