Integrated bake/chill for photoresist processing

IEEE Transactions on Semiconductor Manufacturing

Volumn 12, Issue 2, 1999, Pages 264-266

  El Awady, Khalid ^a   Schaper, Charles D ^a   Kailath, Thomas ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TRANSFER; PHOTORESISTS; SEMICONDUCTING LIQUIDS; SILICON WAFERS; TEMPERATURE CONTROL; THERMAL CYCLING; THERMOELECTRIC EQUIPMENT;

PHOTORESIST PROCESSING; THERMOELECTRIC DEVICES;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0033360475     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.762885     Document Type: Article

References (2)

1. J. Parker and W. Renken, "Temperature metrology for CD control in DUV lithography," Semicond. Int., vol. 20, no. 10, pp. 111-116, 1997.
2. C. Schaper, K. El-Awady, and T. Kailath, "Multizone bake/chill thermal cycling module," U.S. Patent 5 802 856, 1998.