SCOPUS 정보 검색 플랫폼

Volumn 19, Issue 3, 1988, Pages 675-686

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Author keywords

[No Author keywords available]

Indexed keywords

SANDWICH JOINTS; SILVER COPPER SILVER JOINTS; SOLIDIFICATION; TRANSIENT LIQUID PHASE BONDING;

SANDWICH STRUCTURES;

EID: 0023978959 PISSN: 03602133 EISSN: 15431940 Source Type: Journal
DOI: 10.1007/BF02649282 Document Type: Article

Times cited : (306)

References (13)

2
- 0016049518
- (1974) Welding Journal , vol.53 , pp. 175-84
- Niemann, J.T.¹ Garrett, R.A.²

4
- 0343128985
- Carnegie Mellon University, Pittsburgh, PA
- (1976) Center for Joining of Materials Report
- Lesoult, G.¹

5
- 84934924740
- R. F. Sekerka: Carnegie Mellon University, Pittsburgh, PA, unpublished research, 1979.

6
- 84935000424
- Carnegie Mellon University, Pittsburgh, PA
- (1975) Technical Report
- Sekerka, R.F.¹ Jeanfils, C.L.² Heckel, R.W.³

7
- 0003689862
- T. B., Massalski, ASM, Metals Park, OH
- (1986) Binary Alloy Phase Diagrams

8
- 0004255385
- McGraw-Hill Book Co., New York, NY
- (1963) Diffusion in Solids
- Shewmon, P.G.¹

10
- 0003695699
- McGraw-Hill Book Co., New York, NY
- (1969) Applied Statistics for Engineers
- Volk, W.¹

11
- 0014600602
- (1969) Trans. AIME , vol.245 , pp. 2476-79
- Hall, M.G.¹ Haworth, C.W.²

12
- 84915129691
- Diffusion in Copper and Copper Alloys, Part II. Copper-Silver and Copper-Gold Systems
- (1974) Journal of Physical and Chemical Reference Data , vol.3 , pp. 527-602
- Butrymowicz, D.B.¹ Manning, J.R.² Read, M.E.³

13
- 0003969118
- Cambridge University Press, Cambridge
- (1973) The Solid-Liquid Interface
- Woodruff, D.P.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.