Direct liquid injection metal organic chemical vapor deposition of Nd 2O3 thin films using Tris(2,2,6,6-tetramethyl-3,5- heptanedionato) neodymium

Thin Solid Films

Volumn 492, Issue 1-2, 2005, Pages 19-23

  Song, Moon Kyun ^a   Rhee, Shi Woo ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

Chemical vapor deposition (CVD); Dielectrics; Electrical properties and measurements; Oxides

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; DIELECTRIC MATERIALS; DISSOCIATION; LEAKAGE CURRENTS; MORPHOLOGY; NEODYMIUM; OXIDES; PERMITTIVITY; SURFACE ROUGHNESS; THIN FILMS;

DEPOSITION RATE; ELECTRICAL PROPERTIES AND MEASUREMENTS; GATE DIELECTRICS; LIQUID INJECTION;

NEODYMIUM COMPOUNDS;

EID: 25644437684     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.06.027     Document Type: Article

References (11)

1. S. Sayan, S. Aravamudhan, B.W. Busch, W.H. Schulte, F. Cosandey, G.D. Wilk, T. Gustafsson, and E. Garfunkel J. Vac. Sci. Technol., A 20 2002 507
2. V. Rozhkov, A. Trusova, and I. Berezhonoy Thin Solid Films 325 1998 151
3. J. Kwo, M. Hong, B. Busch, D. Muller, Y. Chabal, A. Kortan, J. Mannaerts, B. Yang, P. Ye, H. Hossmann, A. Sergent, K. Ng, J. Bude, W. Schulte, E. Garfunkel, and T. Gustafsson J. Cryst. Growth 251 2003 645
4. Z. Wang, J. Wu, M. Ma, W. Chen, Q. Fang, and J. Zhang Microelectron. Eng. 66 2003 608
5. S. Kang, and S. Rhee J. Electrochem. Soc. 149 2002 C345
6. A. Dakhel J. Alloys Compd. 376 2004 38
7. J. Na, D. Kim, K. Yong, and S. Rhee J. Electrochem. Soc. 149 2002 C23
8. W. Kern Handbook of Semiconductor Wafer Cleaning Technology 1993 Noyes Publication 17
9. M. Langlet, and R. Shannon Thin Solid Films 186 1990 L1
10. A. Dakhel Cryst. Res. Technol. 39 2004 404
11. Joint committee for Powder Diffraction Standards, JCPDS Card No. 340104, Joint Committee for Powder Diffraction Standards, Swarthmore, Pennsylvania, 1984.