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Volumn 37, Issue 4 SUPPL. B, 1998, Pages 2337-2342

Vertical profile control in ultrahigh-aspect-ratio contact hole etching with 0.05-μm-diameter range

Author keywords

C4F8 O2 Ar; CHF3 CO; Contact hole etching; Dipole ring magnetron; High aspect ratio; High density plasma; Reactive ion etching; Secondary ion mass spectrometry; Vertical profile

Indexed keywords

ASPECT RATIO; DEPOSITION; POLYMERS; SECONDARY ION MASS SPECTROMETRY;

EID: 0032050606     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.2337     Document Type: Article
Times cited : (18)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.