Hall effect of copper nitride thin films

Physica Status Solidi (A) Applications and Materials Science

Volumn 202, Issue 10, 2005, Pages 1987-1993

  Yue, G H ^a   Liu, J Z ^a   Li, M ^a   Yuan, X M ^a   Yan, P X ^a   Liu, J L ^a  

^a LANZHOU UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER NITRIDE THIN FILMS; GLASS SUBSTRATES; HALL MOBILITY; RADIO-FREQUENCY (RF);

CARRIER CONCENTRATION; ELECTRIC RESISTANCE; GLASS; HALL EFFECT; MAGNETRON SPUTTERING; SUBSTRATES; TEMPERATURE MEASUREMENT; THIN FILMS;

COPPER COMPOUNDS;

EID: 25444452678     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.200420062     Document Type: Article

References (15)

1. M. Asano, K. Umeda, and A. Tasaki, Jpn. J. Appl. Phys. 29, 1985 (1990).
2. L. Maya, Mater. Res. Soc. Symp. Proc. 282, 203 (1993).
3. L. Maya, H. Tanaka, and K. Kubota, J. Cryst. Growth B 94, 567 (1989).
4. Z. Q. Liu, W. J. Wang, T. M. Wang, S. Chao, and S. K. Zheng, Thin Solid Films 325, 55 (1998).
5. L. Maya, J. Vac. Sci. Technol. A11, 604 (1993).
6. T. Maruyama and T. Morishita, J. Appl. Phys. 78, 4104 (1995).
7. G. H. Yue, P. X. Yan, and J. Wang, J. Cryst. Growth 274, 464 (2005).
8. L. Soukup, M. Sicha, F. Fendrych et al., Surf. Coat. Technol. 116-119, 321 (1999).
9. F. Fendrych, L. Soukup, L. Jastrabik et al., Diam. Relat. Mater. 8, 1715 (1999).
10. G. Soto, J. A. Díaz, and W. de la Cruz, Mater. Lett. 57, 4130 (2003).
11. D. Y. Wang, N. Nakamine, and Y. Hayashi, J. Vac. Sci. Technol. A 16(4), 2084 (1998).
12. K. J. Kim, J. H. Kim, and J. H. Kang, J. Cryst. Growth 222, 767 (2001).
13. L. J. Van der Pauw, Philips Tech. Rev. 20, 220 (1958-1959).
14. T. Nosaka, M. Yoshitake, A. Okamoto, S. Ogawa, and Y. Nakayama, Thin Solid Films 348, 8 (1999).
15. S. Ghosh, F. Singh, D. Choudhary, D. K. Avasthi, V. Ganesan, P. Shah, and A. Gupta, Surf. Coat. Technol. 142-144, 1034 (2001).