Research on applying direct plating to additive process for printed circuit board

Journal of Electronic Materials

Volumn 29, Issue 8, 2000, Pages 1001-1006

  Chiang, Yi Ying ^a   Wang, Yun Yung ^a   Wan, Chi Chao ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CATALYSTS; CHARGE TRANSFER; COPPER PLATING; DEPOSITION; PALLADIUM; PHOTORESISTS; PRINTED CIRCUIT BOARDS; SODIUM COMPOUNDS; TIN;

ADDITIVE PROCESS; DIRECT METALLIZATION;

METALLIZING;

EID: 0034245546     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0164-7     Document Type: Article

References (6)

1. Clyde F. Coombs, Jr., Printed Circuits Handbook, 4th ed. (New York: McGraw-Hill, 1995).
2. H. Akahoshi, IEEE Trans. Comp. Hybrids. Manufact. Technol., CHMT-9, No. 2, 181 (1986).
3. P.E. Kukanskis, and H. Rhodenizer, U.S. patent 4,931,148 (1990).
4. M. Gullar, U.S. patent 5,391,421 (1995).
5. J.J. Bladon and W. Mass, U.S. patent 4,895,739 (1990).
6. C.H. Yang, Y.Y. Wang, and C.C. Wan, J. Electrochem. Soc. 143, 3521 (1996).