Fabrication of copper film on aluminum nitride by novel electroless plating

Journal of the Electrochemical Society

Volumn 150, Issue 4, 2003, Pages

  Yanagimoto, Hiroshi ^a   Akamatsu, Kensuke ^a,c   Deki, Shigehito ^a   Gotoh, Kazuo ^b  

^a KOBE UNIVERSITY   (Japan)

^b Limited   (Japan)

^c KONAN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; COPPER; ELECTROLESS PLATING; INTERFACES (MATERIALS); METALLIC FILMS; NANOSTRUCTURED MATERIALS; OXIDATION; SCANNING ELECTRON MICROSCOPY; STRENGTH OF MATERIALS; SURFACE STRUCTURE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

ADHESIVE STRENGTH; CHEMICAL INTERACTION; INTERFACIAL STRUCTURE;

FILM PREPARATION;

EID: 0037396595     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1560640     Document Type: Article

References (35)

1. K. Hara, K. Sayama, and H. Arakawa, Appl. Catal., A, 189, 127 (1999).
2. N. Toshima, Y. Shiraishi, A. Shiotsuki, D. Ikenaga, and Y. Wang, Eur. Phys. J. D. 16, 209 (2001).
3. E. H. Rahim, F. S. Kamounah, J. Frederiksen, and J. B. Christensen, Nano Lett., 1, 499 (2001).
4. D. W. Bahnemann, S. N. Kholuiskaya, R. Dillert, A. I. Kulak, and A. I. Kokorin, Appl. Catal., B, 36, 161 (2002).
5. E. Groshart, Met. Finish., 70, 85 (1972).
6. G. A. Shafeev, J. M. Themlin, L. Bellard, W. Marine, and A. Cros, J. Vac. Sci. Technol. A, 14, 319 (1996).
7. R. D. Sun, D. A. Tryk, K. Hashomoto, and A. Hujishima, J. Electrochem. Soc., 145, 3378 (1998).
8. S. Zhang, J. De Baets, M. Vereeken, A. Vervaet, and A. Van Calster, J. Electrochem. Soc., 146, 2870 (1999).
9. R. Sard, J. Electrochem. Soc., 117, 864 (1970).
10. R. L. Cohen and K. W. West, J. Electrochem. Soc., 120, 502 (1973).
11. N. Feldstein, M. Schlesinger, N. E. Hedgecock, and S. L. Chow, J. Electrochem. Soc., 121, 738 (1974).
12. J. Horkans, J. Kim, C. McGrath, and L. T. Romankiw, J. Electrochem. Soc., 134, 300 (1987).
13. W. Werdecker and F. Aldinger, IEEE Trans. Compon., Hybrids, Manuf. Technol., CHMT-7, 399 (1984).
14. E. I. Meletis and S. Yan, J. Vac. Sci. Technol. A, 9, 2279 (1991).
15. A. Geith, M. Kulig, T. Hofmann, and C. Rüssel, J. Mater. Sci., 28, 865 (1993).
16. R. R. Lee, J. Am. Ceram. Soc., 74, 2242 (1991).
17. E. W. Osborne and M. G. Norton, J. Mater. Sci., 33, 3859 (1998).
18. Y. Kurokawa, K. Utsumi, H. Takamizawa, T. Kamata, and S. Noguchi, IEEE Trans. Compon., Hybrids, Manuf. Technol., CHMT-8, 247 (1985).
19. H. Yanagimoto, K. Akamatsu, S. Deki, and K. Gotoh, Electrochem. Solid-State Lett., 5, C87 (2002).
20. H. Yanagimoto, K. Akamatsu, S. Deki, and K. Gotoh, J. Mater. Chem., 11, 2387 (2001).
21. H. Homma and K. Kanemitsu, Plat. Surf. Finish., 74, 62 (1987).
22. V. R. Palker, P. Ayyub, S. Chattopadhyay, and M. Multani, Phys. Rev. B, 53, 2167 (1996).
23. S. Z. Chu, M. Sakairi, and H. Takahashi, J. Electrochem. Soc., 147, 1423 (2000).
24. T. E. O'Brien and A. C. D. Chaklader, J. Am. Ceram. Soc., 57, 329 (1974).
25. Y. Yoshino and T. Shibata, J. Am. Ceram. Soc., 75, 2756 (1992).
26. M. Diemer, A. Neubrand, K. P. Trumble and J. Rödel, J. Am. Ceram. Soc., 82, 1825 (1999).
27. V. Curicuta, D. E. Poulain, D. R. Alexander, R. J. De Angelis, S. Gasser, and E. Kolawa, Mater. Sci. Eng., B, 68, 186 (2000).
28. F. S. Ohuchi, R. H. French, and R. V. Kasowski, J. Vac. Sci. Technol. A, 5, 1175 (1987).
29. G. Dehm, C. Scheu, G. Möbus, R. Brydson, and M. Rühle, Ultramicroscopy, 67, 207 (1997).
30. S. T. Kim and C. H. Kim, J. Mater. Sci., 27, 2061 (1992).
31. B. R. Strohmeier, D. E. Leyden, R. S. Field, and D. M. Hercules, J. Catal., 94, 514 (1985).
32. F. S. Yen, H. L. Wen, and Y. T. Hsu, J. Cryst. Growth, 236, 197 (2002).
33. K. Morinaga, T. Torikai, K. Nakagawa, and S. Fujino, Acta Mater., 48, 4735 (2000).
34. F. W. Dynys and J. W. Halloran, J. Am. Ceram. Soc., 65, 442 (1982).
35. M. Kumagai and G. L. Messing, J. Am. Ceram. Soc., 68, 500 (1985).