Silicon optical benches for next generation optical packaging: Going vertical or horizontal?

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1339-1342

  Epitaux, Marc ^a   Pétremand, Yves ^b   Noell, Wilfried ^b   De Rooij, Nico ^b   Verdiell, Jean Marc ^a  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY OF NEUCHÂTEL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

OPTICAL PACKAGING; SILICON OPTICAL BENCHES; SINGLE MODE CONNECTORS;

ELECTRIC WELDING; HERMETIC DEVICES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SILICON; SUBSTRATES;

ELECTRONICS PACKAGING;

EID: 24644451284     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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