Automated assembly and packaging of hybrid optical modules

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1295-1300

  Madsen, Henrik ^b   Shiv, Lior ^b   Elger, Gordon ^a   Hase, Andreas ^a   Heschel, Matthias ^a   Kuhmann, Jochen ^a  

^a Hymite GmbH   (Germany)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; AUTOMATION; COST EFFECTIVENESS; HERMETIC SEALS; MICROELECTRONIC PROCESSING; OPTICAL DESIGN; OPTICAL DEVICES; PHOTODIODES; SEMICONDUCTING SILICON; SEMICONDUCTOR LASERS;

AUTOMATED ASSEMBLY; OPTICAL MODULES; OPTOELECTRONIC PACKAGING; PLANAR LIGHTWAVE CIRCUITS;

ELECTRONICS PACKAGING;

EID: 0038350452     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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