Low cost/high volume laser modules using silicon optical bench technology

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 581-587

  Osenbach, J W ^a   Dautartas, M F ^a   Pitman, E ^a   Nijander, C ^a   Brady, M ^a   Schlenker, R K ^a   Butrie, T ^a   Scrak, S P ^a   Auker, B S ^a   Kern, D ^a   Salko, S ^a   Rinaudo, D ^a   Whitcraft, C ^a   Dormer, J F ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COSTS; DESIGN FOR MANUFACTURABILITY; DIGITAL STORAGE; LENSES; MACHINE DESIGN; MANUFACTURE; NETWORK COMPONENTS; ORGANIC LASERS; PHOTODIODES; SILICON; SILICON COMPOUNDS; COST EFFECTIVENESS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; RELIABILITY; SEMICONDUCTING SILICON; SEMICONDUCTOR LASERS; SILICON ON INSULATOR TECHNOLOGY; THERMAL CYCLING;

CHANGING MARKETPLACES; EDGE EMITTING LASERS; ENABLING TECHNOLOGIES; OPTOELECTRONIC MODULES; SILICON MICROMACHINING; SILICON OPTICAL BENCH; TECHNOLOGY AND DESIGNS; TEMPERATURE CYCLING;

LASER MIRRORS; INTEGRATED OPTOELECTRONICS;

OPTICAL SUBASSEMBLY (OSB); SILICON OPTICAL BENCH (SIOB) TECHNOLOGY;

EID: 0031624425     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678753     Document Type: Conference Paper

References (8)

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