In package micro-aligner for fiber-optic packaging

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1446-1449

  Haake, J M ^a,b   Beranek, M W ^a  

^a BOEING COMPANY   (United States)

^b Nuvonyx Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HOUSING; NETWORK COMPONENTS; OPTICAL FIBER FABRICATION; OPTICAL FIBERS; SILICON WAFERS; ACTUATORS; FIBER OPTICS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING;

BENDING STIFFNESS; FABRICATED DEVICE; FORCE AND DISPLACEMENTS; MICRO-OPTIC COMPONENTS; OPTOELECTRONIC PACKAGES; PACKAGE CONFIGURATIONS; PROTOTYPE DEVICES; SILICON MICROMACHINING; IN PACKAGE MICRO ALIGNERS;

FIBER OPTICS; ELECTRONICS PACKAGING;

EID: 0031620339     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678934     Document Type: Conference Paper

References (12)

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