Investigation of phase change of flip chip solders during the second level interconnect reflow

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 894-900

  Chung, Soonwan ^a   Tang, Zhenming ^a   Park, Seungbae ^a  

^a State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP INTERCONNECTS; PHASE CHANGE; REFLOW CYCLE;

CRACKS; DELAMINATION; LEAD; MELTING; PARAMETER ESTIMATION; THERMAL EFFECTS;

SOLDERING ALLOYS;

EID: 24644439628     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)

1. M.M. El-Bahay, M.E.El Mossalamy, M.Mahdy, A.A. Bahgat, "Some mechanical properties of Sn-3.5Ag eutectic alloy at different temperatures," J. Mater. Sci: Materials in Electronics, 15 (2004), pp.519-526.
2. rd ECTC, New Orleans, LA, May 27-30, 2003, pp.809-815.
3. Thomas Siewert, Stephen Liu, David R. Smith, and Juan Carlos Madeni, "Database for Solder Properties with Emphasis on New Lead-free Solders," Properties of Lead-Free Solders, Release 4.0, February 11, 2002.
4. D.R.Frear, J.W.Jang, J.K.Lin, and C.Zhang, "Pb-free Solders for Flip-Chip Interconnects," JOM, 53(6) (2001), pp.28-32.
5. J.C.Foley, A.Gickler, F.H.Leprevost, and D.Brown, "Analysis of Ring and Plug Shear Strengths for Comparison of Lead-free Solders," Journal of Electronic Materials, 29(10) 2000, pp.1258-1263.
6. rd ECTC, New Orleans, LA, May 27-30, 2003, pp.809-815.
7. M.Huang, Z.Suo, Q.Ma, and H.Fujimoto, "Thin film cracking and ratcheting caused by temperature cycling", J. Mater. Res., 15(6) (2000), pp.1239-1242.
8. J. Kuczynski, A.K. Sinha, "Strain measurement and numerical analysis of an epoxy adhesive subjected to thermal loads," IBM J. Res. & Dev. 45(6), (2001), pp783-788.
9. Zhengfang Qian, Jain Yang, and Sheng Liu, "Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills," IEEE Transactions on Components and Packaging Technology, 22(2), 1999, pp. 152-157.
10. ANSYS University Advanced, Release 9.0.
11. http://www.daltonelectric.com/Engineering-Data-and-Design-Considerations. htm
12. http://tds.loctite.com/tds5/docs/H-FP4527-EN.PDF
13. Qizhou Yao, Jianmin Qu, Jiali Wu, and C.P. Wong, "Characterization of Underfill/Substrate Interfacial Toughness Enhancement by Silane Additives," IEEE Transactions on Electronics Packaging Manufacturing, 22(4), 1999, pp.264-267.
14. Kumar Nagarajan, Reinhold H. Dauskardt, "Adhesion and Reliability of Underfill/Substrate Interfaces in Flipchip BGA Packages: Metrology and Characterization," Proc. Pan Pacific Symposium Conference 2002.
15. Xiang Dai, Mark V.Brillhart, and Paul S.Ho, "Adhesion Measurement for Electronic Packaging Applications Using Double Cantilever Beam Method," IEEE Transactions on Components and Packaging Technology, 23(1), 2000, pp.101-116.
16. E.F.Rybicki and M.F.Kanninen, "A finite element calculation of stress intensity factors by a modified crack closure integral," Engineering Fracture Mechanics, 9, 1977, pp.931-938.
17. Adam Kuhl and Jianmin Qu, "A Technique to Measure Interfacial Toughness Over a Range of Phase Angles," J. of Electronic Packaging, 122, 2000, pp.147-151.
18. Mitul Modi and Suresh K. Sitaraman, "Interfacial Fracture Toughness Measurement of a Ti/Si Interface," J. of Electronic Packaging, 126, 2004, pp.301-307.
19. S.Erpolat, I.A.Ashcroft, A.D.Crocombe, and M.A.Wahab, "On the analytical determination of strain energy release rate in bonded DCB joints," Engineering Fracture Mechanics, 71, 2004, pp.1393-1401.
20. Arun Agrawal, P.-Y. Ben Jar, "Analysis of specimen thickness effect on interlaminar fracture toughness of fibre composites using finite element models," Composites Science and Technology, 63, 2003, pp. 1393-1402.
21. nd ECTC, San Diego, CA, May 28-31, 2002, pp.1373-1379.