Strain measurement and numerical analysis of an epoxy adhesive subjected to thermal loads

IBM Journal of Research and Development

Volumn 45, Issue 6, 2001, Pages 783-788

  Kuczynski, J ^a   Sinha, A K ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CURING; EPOXY RESINS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RESIDUAL STRESSES; STRAIN GAGES; STRAIN MEASUREMENT; THERMAL CYCLING;

ELECTRONIC ASSEMBLIES;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 0035516598     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.456.0783     Document Type: Article

References (6)

1. The use of finite element analysis and strain gauge measurements in the determination of residual stress
2. Fundamental concept in measuring of residual stresses based on finite element method and reliability of estimated values
3. New measuring method of three dimensional welding residual stresses based on newly proposed principle of inherent strain
4. Thermally conductive dielectrics for insulated metal core cards