Microstructural and performance implications for gold in Sn-Ag-Cu-Sb interconnections

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 809-815

  Peng, Weiqun ^a   Dunford, Steve ^a   Viswanadham, Puligandla ^a   Quander, Stephen ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

Component; Failure mechanism; Gold plating; Grain boundary; Intermetallic compounds; Joint reliability; Lead free; Solder; Substrate

Indexed keywords

CRACK PROPAGATION; FAILURE ANALYSIS; GOLD PLATING; INTERMETALLICS; METALLURGY; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EXPANSION; TIN ALLOYS;

CERAMIC CHIP CARRIER COMPONENT TERMINALS; INTERCONNECTION MATERIALS; METALLURGICAL ANALYSIS; ORGANIC CHIP CARRIER COMPONENT TERMINALS;

ELECTRONICS PACKAGING;

EID: 0038012576     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)

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