Interfacial fracture toughness measurement of a Ti/Si interface

Journal of Electronic Packaging

Volumn 126, Issue 3, 2004, Pages 301-307

  Modi, Mitul ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CRACK PROPAGATION; DELAMINATION; ELASTICITY; FABRICATION; INTERFACES (MATERIALS); MECHANICAL VARIABLES MEASUREMENT; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; SILICON; STRUCTURAL LOADS; THIN FILMS; TITANIUM;

CRACK TIP; MODIFIED DECOHESION TESTS (MDT); SURFACE AREA; THIN FILM INTERFACES;

FRACTURE TOUGHNESS;

EID: 12344257888     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1772410     Document Type: Article

References (14)

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