Dynamic modeling for resin self-alignment mechanism

Microelectronics Reliability

Volumn 44, Issue 6, 2004, Pages 983-992

  Kim, J M ^a   Shin, Y E ^b   Fujimoto, K ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; OPTOELECTRONIC DEVICES; SOLDERING ALLOYS; SURFACE TENSION; VISCOSITY;

MICROOPTOELECTROMECHANICAL SYSTEMS (MOEMS); OSCILLATORY MOTIONS; SELF-ALIGNMENT PROCESS;

RESINS;

EID: 2442590890     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.01.006     Document Type: Article

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