Electron microscopy observation of interface in diffusion-bonded copper joint

Journal of Electron Microscopy

Volumn 53, Issue 2, 2004, Pages 157-161

  Wang, Airu ^a   Ohashi, Osamu ^a   Yamaguchi, Norio ^a   Xie, Guoqiang ^b   Song, Minghui ^b   Furuya, Kazuo ^b   Higashi, Yasuo ^c   Hitomi, Nobuteru ^c  

^a NIIGATA UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^c HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION KEK   (Japan)

Author keywords

Argon ion bombardment; Diffusion bonding; Fractured surface; HRTEM; Interface; SEM

Indexed keywords

ARGON; DIFFUSION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; ION BOMBARDMENT; OXIDE FILMS; TENSILE STRENGTH; X RAY SPECTROSCOPY;

ARGON ION; ARGON ION BOMBARDMENT; BONDED JOINT; FRACTURED SURFACES; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; IONS BOMBARDMENT; OXYGEN FREE HIGH CONDUCTIVITY COPPER; SCANNING RESOLUTION; SURFACE CONDITIONS; X-RAY SPECTROSCOPY;

SCANNING ELECTRON MICROSCOPY;

EID: 2442482723     PISSN: 00220744     EISSN: None     Source Type: Journal    
DOI: 10.1093/jmicro/53.2.157     Document Type: Conference Paper

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