Effect of surface condition and bonding pressure on quality of diffusion bonded high purity copper for linear collider accelerator structures

Science and Technology of Welding and Joining

Volumn 6, Issue 5, 2001, Pages 268-272

  Elmer, J W ^a   Klingman, J ^a   Van Bibber, K ^a  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035648635     PISSN: 13621718     EISSN: None     Source Type: Journal    
DOI: 10.1179/136217101101538857     Document Type: Article

References (9)

1. 'Zeroth-order design report for the next linear collider', LBNL5424, SLAC-474, UCRL ID-124161, UC 414, Vol. 1, NLC Design Group, Stanford, CA, USA, May 1996; available at www.slac.stanford.edu.
2. J. W. WANG et al.: Proc. 1999 Particle Accelerator Conf., New York, USA, IEEE, 3423-3425.
3. J. KLINGMANN: Proc. 1999 Particle Accelerator Conf., New York, USA, IEEE, 777-779.
4. H. A. HOAG et al.: Proc. 1999 Particle Accelerator Conf., New York, USA, IEEE, 907-909.
5. K. ASANO: Proc. 1999 Particle Accelerator Conf., New York, USA, IEEE, 3417-3419.
6. J. W. ELMER, J. KLINGMANN, and K. VAN BIBBER: Phys. Rev. Special Topics: Accelerators Beams, 23 May 2001, 4. 053502 (see www. prsb-ab.aps.org).
7. L. E. MURR: 'Interfacial phenomena in metals and alloys': 1975, Reading, MA. Addison Wesley.
8. G. W. CUNNINGHAM and J. W. SPRETNAK: Trans. AIME, 1963, 227, (2), 7.
9. 'Metals handbook', 9th edn. Vol. 2, 277: 1979, Metals Park, OH, ASM.