Novel multilayered Ti/TiN diffusion barrier for Al metallization

Journal of Electronic Materials

Volumn 34, Issue 8, 2005, Pages 1150-1156

  Wu, Wen Fa ^a   Tsai, Kou Chiang ^a,b   Chao, Chuen Guang ^b   Chen, Jen Chung ^b   Ou, Keng Liang ^c  

^a NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^c TAIPEI MEDICAL UNIVERSITY   (Taiwan)

Author keywords

Aluminum; Diffusion barrier; Multilayer; Titanium nitride

Indexed keywords

ALUMINUM; DIFFUSION; GRAIN BOUNDARIES; METALLIZING; MULTILAYERS; REACTION KINETICS;

BARRIER PERFORMANCE; COLUMNAR GROWTH; DIFFUSION BARRIERS; INTERDIFFUSION;

TITANIUM NITRIDE;

EID: 24144475074     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0244-9     Document Type: Article

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