Highly (111) textured titanium nitride layers for sub-quarter-micrometer Al metallization

Electrochemical and Solid-State Letters

Volumn 2, Issue 7, 1999, Pages 342-344

  Wu, Wen Fa ^a   Lin, Chien Cheng ^b   Huang, Chyi Chyuan ^b   Lin, Horng Chih ^a   Chang, Ting Chang ^a,c   Yang, Rong Ping ^a   Huang, Tiao Yuan ^a,b  

^a NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC CONTACTS; METALLIZING; SPUTTER DEPOSITION; TEXTURES; TITANIUM NITRIDE;

SUBQUARTER-MICROMETER CONTACT HOLES;

METALLIC FILMS;

EID: 0032626148     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390830     Document Type: Article

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