Photon emission microscopy of inter/intra chip device performance variations

Microelectronics Reliability

Volumn 45, Issue 9-11, 2005, Pages 1471-1475

  Polonsky, S ^a   Bhushan, M ^b   Gattiker, A ^c   Weger, A ^a   Song, P ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

^c IBM AUSTIN RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LIGHT EMISSION; MOSFET DEVICES; PHOTONS; SILICON WAFERS;

INFRARED EMISSION; OFF-STATE CURRENT; OPTICAL TECHNIQUE; PHOTON EMISSION MICROSCOPY;

MICROPROCESSOR CHIPS;

EID: 24144444103     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.031     Document Type: Conference Paper

References (8)

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7. S. Polonsky, and K.A. Jenkins Time-resolved measurements of self-heating in SOI and strained-silicon MOSFETs using photon emission microscopy IEEE Electron Device Letters 25 4 2004 208 210
8. Song, P., et al., A novel scan chain diagnostics technique based on light emission from leakage current, Proceedings of International Test Conference, 2004, pp. 140-147.