Fluxless wetting propeities of one-side-coated under bump metallurgy and top surface metallurgy

Journal of Electronic Materials

Volumn 30, Issue 8, 2001, Pages 937-944

  Hong, Soon Min ^a   Park, Jae Yong ^a   Jung, Jae Pil ^b   Kang, Choon Sik ^a  

^a Seoul National University   (South Korea)

^b University of Seoul   (South Korea)

Author keywords

fluxless soldering; Solder; top surface metallurgy; under bump metallurgy; wettability; wetting balance test

Indexed keywords

BINARY ALLOYS; CHROMIUM ALLOYS; CONTACT ANGLE; COPPER; GLASS; GOLD; LEAD ALLOYS; LEAD-FREE SOLDERS; NICKEL; SILICON WAFERS; SOLDERING; SUBSTRATES; TIN ALLOYS; TITANIUM ALLOYS; METALLURGY; SOLDERING ALLOYS; WETTING;

FLUX-LESS SOLDERING; FLUXLESS; SI WAFER; SNPB SOLDER; TOP SURFACE; TOP SURFACE METALLURGY; UNDER-BUMP METALLURGIES; WETTING BALANCE; WETTING BALANCE TEST; WETTING PROPERTY;

WETTING; SILICON WAFERS;

FLUXLESS SOLDERING; TOP SURFACE METALLURGY (USF); UNDER BUMP METALLURGY (UBM);

EID: 0035416112     PISSN: 03615235     EISSN: 1543186X     Source Type: Journal    
DOI: 10.1007/BF02657714     Document Type: Conference Paper

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