Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

Journal of Applied Physics

Volumn 98, Issue 3, 2005, Pages

  Lee, Teck Kheng ^a,b   Zhang, Sam ^b   Wong, Chee Cheong ^c   Tan, Ah Chin ^a  

^a MICRON TECHNOLOGY INC   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FLUXLESS BONDING; METALLIC STUD BUMPS; MICROELECTRONIC PACKAGING; MOLTEN SOLDER;

BONDING; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; FLUXES; MOLTEN MATERIALS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SOLIDIFICATION; TIN COMPOUNDS; X RAY ANALYSIS;

ELECTRONICS PACKAGING;

EID: 23944432395     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1997291     Document Type: Article

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