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Volumn 2, Issue , 2004, Pages 1209-1215

A novel joint-in-via, flip-chip chip-scale package

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS BUMPING PROCESS; ELECTROPLATING BUMPING PROCESS; PHOTOMASKS; SOLDERMASKS;

EID: 10444271768     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (5)

References (19)
  • 5
    • 84964578150 scopus 로고    scopus 로고
    • Packaging processes using flip chip bonder and future directions of technology development
    • 4th, 10-12, Dec.
    • Hatanaka, H., "Packaging processes using flip chip bonder and future directions of technology development," Electronics Packaging Technology Conference, 2002. 4th, 10-12, Dec. 2002, pp.434-439.
    • (2002) Electronics Packaging Technology Conference, 2002 , pp. 434-439
    • Hatanaka, H.1
  • 6
    • 10444241545 scopus 로고
    • High volume flip chip applications
    • Berlin, Germany, Nov
    • M. Meehan et al., "High volume flip chip applications," in Proceeding of Area Packaging Technology, Berlin, Germany, Nov 1995.
    • (1995) Proceeding of Area Packaging Technology
    • Meehan, M.1
  • 8
    • 0036396982 scopus 로고    scopus 로고
    • Tape based CSP package supports fine pitch wirebonding
    • IEMT 2002, 27th Annual IEEE/SEMI International, 17-18 July
    • John Geissinger, Frank Keller, Scott Trevino, Toru Kamei, "Tape Based CSP Package Supports Fine Pitch Wirebonding," Electronics Manufacturing Technology Symposium, 2002. IEMT 2002, 27th Annual IEEE/SEMI International, 17-18 July 2002, pp. 41-452.
    • (2002) Electronics Manufacturing Technology Symposium, 2002 , pp. 41-452
    • Geissinger, J.1    Keller, F.2    Trevino, S.3    Kamei, T.4
  • 9
    • 0036294546 scopus 로고    scopus 로고
    • Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener
    • 28-31 May
    • Guo-wei Xiao, Chan, P.C.H., Lee, R.S.W., Yuen, M.M.F., "Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener," IEEE, 2002. Proceedings 52nd, 28-31 May 2002, pp. 112 -118.
    • (2002) IEEE, 2002. Proceedings 52nd , pp. 112-118
    • Xiao, G.-W.1    Chan, P.C.H.2    Lee, R.S.W.3    Yuen, M.M.F.4
  • 10
  • 12
  • 14
    • 84952321295 scopus 로고    scopus 로고
    • Industrial approach of a flip-chip method using the stud-bumps with a non-conductive paste
    • Proceedings. 4th International Conference on, June
    • Ferrando, F., Zeberli, J.-F., Clot, P., Chenuz, J.-M., "Industrial approach of a flip-chip method using the stud-bumps with a non-conductive paste," Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on, 1821, June 2000, pp. 205-211.
    • (2000) Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. , vol.1821 , pp. 205-211
    • Ferrando, F.1    Zeberli, J.-F.2    Clot, P.3    Chenuz, J.-M.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.