A fluxless Sn-In bonding process achieving high re-melting temperature

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 671-674

  Chuang, R W ^a   Choe, S ^a   Lee, C C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; METALLOGRAPHIC MICROSTRUCTURE; MULTILAYERS; PHASE DIAGRAMS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; TEMPERATURE; TIN ALLOYS;

FLUXLESS BONDING; INDIUM TIN MULTILAYER COMPOSITE; REMELTING TEMPERATURE;

SOLDERING;

EID: 0034822648     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. A new bonding technology using gold and tin multilayer composite structures
2. Advances in bonding technology for electronic packaging
3. A fluxless bonding technology using indium-silver multilayer composites
4. Low temperature fluxless bonding technique using In-Sn composite
5. Diffusion in the goldindium system
6. Low temperature interdiffusion in Au-In thin film couples
7. Thin film interdiffusion of Au and In at room temperature