Damascene chemical-mechanical polishing characterization and modeling for for silicon microelectromechanical systems structures

Journal of the Electrochemical Society

Volumn 152, Issue 7, 2005, Pages

  Tang, Brian D ^a   Xie, Xiaolin ^a   Boning, Duane S ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; INTEGRATED CIRCUITS; LITHOGRAPHY; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; NITRIDES; POLYSILICON; SILICON WAFERS; STIFFNESS;

INTEGRATED CIRCUIT APPLICATIONS; INTEGRATED CIRCUIT INDUSTRY; MICROELECTROMECHANICAL SYSTEM STRUCTURES; SURFACE-MACHINED POLYSILICON;

MICROELECTROMECHANICAL DEVICES;

EID: 23744479963     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1933542     Document Type: Article

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