CMOS chip planarization by chemical mechanical polishing for a vertically stacked metal MEMS integration

Journal of Micromechanics and Microengineering

Volumn 14, Issue 1, 2004, Pages 108-115

  Lee, Hocheol ^a   Miller, Michele H ^b   Bifano, Thomas G ^c  

^a Hanbat National University   (South Korea)

^b MICHIGAN TECHNOLOGICAL UNIVERSITY   (United States)

^c BOSTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; MIRRORS; POLISHING; SILICON NITRIDE;

CHIP PLANARIZATION; MICROMIRROR ARRAYS;

MICROELECTROMECHANICAL DEVICES;

EID: 0942300904     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/1/015     Document Type: Article

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