Computer simulated dense-random packing models as approach to the structure of porous low-k dielectrics

Microelectronic Engineering

Volumn 81, Issue 2-4, 2005, Pages 535-543

  Hermann, H ^a   Elsner, A ^a   Hecker, M ^a   Stoyan, D ^b  

^a IFW DRESDEN   (Germany)

^b TU BERGAKADEMIE FREIBERG   (Germany)

Author keywords

Dense random packing model; Elastic constants; Low k dielectrics; Pore size distribution; Porosity

Indexed keywords

COMPUTER SIMULATION; ELASTIC MODULI; ELECTRIC INSULATORS; MATHEMATICAL MODELS; PERMITTIVITY; PORE SIZE; POROSITY;

DENSE-RANDOM PACKAGING MODEL; EFFECTIVE DIELECTRIC CONSTANTS; ELASTIC CONSTANTS; LOW-K DIELECTRICS;

DIELECTRIC MATERIALS;

EID: 23444445736     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.03.058     Document Type: Conference Paper

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