Effects of pressure sensor dimensions on process window of membrane thickness

Sensors and Actuators, A: Physical

Volumn 112, Issue 2-3, 2004, Pages 286-290

  Gong, Shih Chin ^a,b  

^a ASIA PACIFIC MICROSYSTEMS INC   (Taiwan)

^b UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Membrane; MEMS; Microsensors; Pressure sensors; Process window

Indexed keywords

COMPUTER SIMULATION; COSTS; DOPING (ADDITIVES); FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; MEMBRANES; MICROELECTROMECHANICAL DEVICES; OPTICAL RESOLVING POWER; RESISTORS; SENSITIVITY ANALYSIS; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; SOLUTIONS; THERMAL EFFECTS;

MEMBRANE ROUGHNESS; MEMBRANE THICKNESS; PRECISION GRINDING; PRESSURE SENSORS; PROCESS WINDOW;

MICROSENSORS;

EID: 2342639628     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.02.001     Document Type: Article

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