Extreme ultraviolet lithography based nanofabrication using a bilevel photoresist

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 2, 2004, Pages 781-784

  Talin, A A ^a   Cardinale, G F ^a   Wallow, T I ^a   Dentinger, P ^a   Pathak, S ^a   Chinn, D ^a   Folk, D R ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DISSOLUTION; ELECTRON BEAMS; EVAPORATORS; GOLD; IMAGE ANALYSIS; IMAGING TECHNIQUES; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; OPTIMIZATION; ORGANIC POLYMERS; REFLECTOMETERS; SENSITIVITY ANALYSIS; SILICON WAFERS; ULTRAVIOLET RADIATION;

ELECTRON BEAM (EB) EVAPORATORS; EXTREME ULTRAVIOLET LITHOGRAPHY (EUVL); FILM THICKNESS; POLYDIMETHYLGLUTARIMIDE (PMGI);

PHOTORESISTS;

EID: 2342630548     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1689308     Document Type: Article

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