Constitutive Model for Sn-Pb Solder under Fatigue Loading

International Journal of Damage Mechanics

Volumn 13, Issue 2, 2004, Pages 147-162

  Wei, Y ^a   Chow, C L ^a   Neilsen, M K ^b   Fang, H E ^b  

^a University of Michigan Dearborn   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Damage; Fatigue life; Grain coarsening; Hold time; Load drop; Solder; Strain rate; Viscoplastic

Indexed keywords

ELASTIC MODULI; FATIGUE OF MATERIALS; GRAIN SIZE AND SHAPE; JOINTS (STRUCTURAL COMPONENTS); MATHEMATICAL MODELS; STRAIN RATE; VISCOPLASTICITY;

CYCLIC FREQUENCY; FATIGUE LOADING; GRAIN COARSENING; SOLDER FATIGUE TESTING;

SOLDERING ALLOYS;

EID: 2342523295     PISSN: 10567895     EISSN: None     Source Type: Journal    
DOI: 10.1177/1056789504041056     Document Type: Article

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