Characteristics of creep damage for 60 Sn-40 Pb solder material

Journal of Electronic Packaging

Volumn 123, Issue 3, 2001, Pages 278-283

  Wei, Y ^a   Chow, C L ^a   Fang, H E ^b   Neilsen, M K ^b  

^a University of Michigan Dearborn   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0037593833     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1372319     Document Type: Article

References (17)

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