A full-scale 3D finite element analysis for no-underfill flip chip package

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn , Issue , 2002, Pages 311-318

  Hsu, S M ^a   Lin, J C ^a   Chiang, K N ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Constrained material; Equivalent beam; No underfill flip chip; Reliability

Indexed keywords

CHIP SCALE PACKAGES; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MECHANICAL ENGINEERING; PACKAGING; QUALITY ASSURANCE; RELIABILITY; SPOT WELDING; SUBSTRATES; THERMAL EXPANSION; THREE DIMENSIONAL;

3D FINITE ELEMENT MODEL; 3D-FINITE ELEMENT ANALYSIS; COMPUTATION TIME; CONSTRAINED MATERIAL; CONSTRAINED STRUCTURE; EQUIVALENT BEAMS; FINITE ELEMENT MODELS; FLIP CHIP; FLIP CHIP BGA; FLIP-CHIP PACKAGES; MECHANICAL BEHAVIOR; MICRO-MACRO; NEW DESIGN; ORGANIC SUBSTRATE; PACKAGE RELIABILITY; SOLDER JOINTS; THERMAL PERFORMANCE; UNDERFILLS;

STRUCTURAL DESIGN;

EID: 78249276204     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-39674     Document Type: Conference Paper

References (13)

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